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Solderball Mechnical ÃøÁ¤ ¹æ¹ý¿¡ ´ëÇØ Á¶»çÇÑ ·¹Æ÷Æ® ÀÔ´Ï´Ù. [°øÇÐ]¹«¿¬¼Ö´õÀDZâ°èÀûƯ¼ºÃøÁ¤ / 1. Mechanical Bonding 2. Tensile Preperties 3. Shear Properties 4. Creep 5. Fatigue / Pb-Free Solder´Â Á¾Àü¿¡ »ç¿ëµÇ¾î ¿À´ø Pb Solder¿¡¼ Pb¿¡ ÀÇÇÑ Áßµ¶, ¶Ç´Â Pb°¡ Àΰ£¿¡°Ô À¯ÇØÇÏ´Ù´Â ÀÌÀ¯·Î ÃÖ±Ù Pb SolderÀÇ »ç¿ë¿¡ ±ÔÁ¦°¡ ÇÑâ ³ªÅ¸³ª°í ÀÖ´Ù. Pb´Â Æó±âµÈ Àü±â¡¦ |
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°øÇбâ¼ú  | 
2p age   | 
1,000 ¿ø
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¡¥rÀÇ ±â°èÀû Ư¼º Æò°¡ 3. º»·Ð 3.1 Mechanical Bonding Test 3.1.1 Tensile Properties 3.1.2 Shear Properties 3.2 Creep 3.3 Fatigue 4. °á·Ð 5. Reference / ÀÌ·¯ÇÑ °üÁ¡¿¡¼ Pb Solder´Â PbÀÇ ¸ÅÀå·®ÀÌ ³ô°í, °áÂø¼ºÀÌ ÁÁÀ¸¸ç °¡Àå ÁÁÀº Ư¼ºÀ¸·Î´Â ³·Àº À¶Á¡ ¶§¹®¿¡ Pb SolderÀÇ »ç¿ëÀÌ ³Î¸® ÆÛÁ® ÀÖ¾ú´Ù. »ç½Ç Á¢Çպο¡ Pb¸¦ »ç¿ëÇÏ´Â °ÍÀº Àüµµµµ°¡ ÁÁ±â ¶§¹®Àº ¾Æ´Ï´Ù¡¦ |
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°øÇбâ¼ú  | 
22p age   | 
3,000 ¿ø
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Material Behaviors¿¡ ´ëÇÑ ³»¿ëÀÔ´Ï´Ù. / 1. Explain what happens in terms of mechanical/chemical properties when making products using metal-based 3D additive manufacturing technology 2. Explain alterations of the metal microstructure ch-aracteristics when making products using metal-based 3D additive manufacturing technology and the relationship between the¡¦ |
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°øÇбâ¼ú  | 
6p age   | 
3,000 ¿ø
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SPM °ü·Ã °³¹ß ±â¼ú·Î´Â LFM(Lateral Force Microscope): Ç¥¸éÀÇ ¸¶Âû·ÂÀ» Àç´Â ¿øÀÚÇö¹Ì°æ, FMM(Force Modulation Microscope): ½Ã·áÀÇ °æµµ(ÌãÓø)¸¦ Àç´Â ¿øÀÚÇö¹Ì°æ, PDM(Phase Detection Microscope) : ½Ã·áÀÇ Åº¼º ¹× Á¡¼ºµîÀ» Àç´Â ¿øÀÚÇö¹Ì°æ, MFM(Magnetic Force Microscope): ÀÚ±â·Â(í¸Ñ¨Õô)À» Àç´Â ¿øÀÚÇö¹Ì°æ, EFM(Electrostatic Force Microscope): ½Ã·áÀÇ Àü±âÀû Ư¼ºÀ» Àç´Â¡¦ |
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°øÇбâ¼ú  | 
8p age   | 
1,000 ¿ø
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À¯ºñÄõÅͽº¿Í RF-ID¿¡ ´ëÇØ Á¶»çÇÑ ÀÚ·áÀÔ´Ï´Ù. À¯ºñÄõÅͽº¿ÍRF-id / MEMS(Micro Electro Mechanical Systems)´Â ÃʼÒÇü ½Ã½ºÅÛÀ̳ª ÃʼÒÇü Á¤¹Ð±â°è¸¦ ¸»ÇÏ¸ç ¸¶ÀÌÅ©·Î ½Ã½ºÅÛ, ¸¶ÀÌÅ©·Î ¸Ó½Å, ¸¶ÀÌÅ©·Î ¸ÞÄ«Æ®·Î´Ð½º µîÀ¸·Îµµ ºÎ¸£°í ÀÖ´Ù. MEMS ÀåÄ¡´Â Å©±â°¡ À۱⠶§¹®¿¡ ¾ÆÁÖ Á¼Àº °ø°£¿¡¼µµ »ç¿ëÇÒ ¼ö ÀÖ¾î ±â°èÀåÄ¡ ¶Ç´Â »ç¶÷ÀÇ ½Åü ³»ºÎ¿¡ µé¾î°¡ ¿©·¯ °¡Áö È°µ¿À» ÇÒ ¼ö ÀÖ´Ù¡¦ |
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°øÇбâ¼ú  | 
10p age   | 
1,000 ¿ø
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[·Îº¿°øÇÐ] ·Îº¿ °øÇÐ ¿¬±¸½Ç / ·Îº¿ °øÇÐ ¿¬±¸½Ç ·Îº¿°øÇнÇÇè ½ÇÇ赿 2-4È£ 1. Robot 1) »çÀüÀû ÀÇ¹Ì 2) ·Îº¿ÀÇ Á߿伺 2. ·Îº¿ÀÇÁ¦ÀÛ °úÁ¤ 1) ·Îº¿ Á¦ÀÛÀÇ ±¸»ó 2) Hardware 3) Software 3. ·Îº¿°øÇÐ ¿¬±¸½Ç ¼öÇà ¼Ò°¨ 1. Robot 1) »çÀüÀûÀÇ¹Ì ·Îº¿Àº »ç¶÷°ú À¯»çÇÑ ¸ð½À°ú ±â´ÉÀ» °¡Áø ±â°è, ¶Ç´Â ¹«¾ùÀΰ¡ ½º½º·Î ÀÛ¾÷ÇÏ´Â ´É·ÂÀ» °¡Áø ±â°è¸¦ ¸»ÇÑ´Ù. A robot is a ¡¦ |
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°øÇбâ¼ú  | 
4p age   | 
1,200 ¿ø
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¡¥±â¼ ±Þ°ÝÈ÷ ºÎ°¢µÈ MEMS(Micro Electro Mechanical System)ºÐ¾ß´Â ÃʼÒÇü ±¸Á¶¹°, ¼¾¼, ¾×Ãß¿¡ÀÌÅÍ µî ¹Ì¼Ò ¼ÒÀÚ¸¦ Á¦ÀÛÇÏ°í À̸¦ ÀÀ¿ëÇÑ ½Ã½ºÅÛÀ» Á¦ÀÛÇÏ´Â ¿¬±¸ ºÐ¾ß À̸ç, ÃÖ±Ù ±¹³»¿ÜÀûÀ¸·Î È°¹ßÈ÷ ¿¬±¸µÇ°í ÀÖ°í Åë½Å, ¹ÙÀÌ¿ÀµîÀÇ ¹Ì·¡ »ê¾÷ÀÇ Çٽɱâ¼ú·Î¼ ÀÚ¸®¸Å±èÇØ °¡°í ÀÖ´Ù. ÀÌÁ¦´Â »ê¾÷°èÀÇ Àü ºÐ¾ß¿¡¼µµ È°¹ßÇÑ MEMS ºÐ¾ß°¡ Àû¿ëµÈ »õ·Î¿î ±â¼úµéÀÌ ¼±º¸ÀÏ °ÍÀÌ´Ù. ±¹¡¦ |
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°øÇбâ¼ú  | 
11p age   | 
1,700 ¿ø
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À¯ºñÄõÅͽº ÄÄÇ»ÆÃÀÇ Á¤ÀÇ¿Í Æ¯Â¡ °ü·Ã±â¼ú µî¿¡ ´ëÇØ Á¶»çÇÑ ÀÚ·áÀÔ´Ï´Ù. À¯ºñÄõÅͽºÇõ¸íUbiquitousRevolution / Micro Electro Mechanical System: ¹Ì¼¼ÀüÀÚ±â°è½Ã½ºÅÛ ÀüÀÚ (¹ÝµµÃ¼) ±â¼ú, ±â°è ±â¼ú, ¡¦ |
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°øÇбâ¼ú  | 
27p age   | 
1,000 ¿ø
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´ÙÀÌ¿Àµå ·¹ÀÌÀú(980nm ÆÄÀå)ÀÇ ±Ù°üÁ¶»ç½Ã ¿Âµµ»ó½Â¿¡ °üÇÑ °íÂû ÀÚ·áÀÔ´Ï´Ù. Diodelaser / Root canal Tx. ÀÇ ¸ñÀû : germ free situation all organic tissue residuals Á¦°Å dense closing of the¡¦ |
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°øÇбâ¼ú  | 
23p age   | 
1,000 ¿ø
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