[1]J-M. Huang, K.M.Liew, C.H. Wong, S.Rajendran, M.J. Tan, A.G.Liu, “Mechanical design and optimization of capacitive micromachined switch”, Sensors and Actuators A, (2001), 273-285
[2]Dan Haroniam, “Maximizing microelectormechanical sensor and actuator sensitivity by optimizing geometry“, Sensors and Actuators A, (1995) 223-236
[3]Oliver Nagler, Michael Trost, Bernd Hillerich, Frank Kozlowski, “Efficient design and optimization of MEMS by integrating commercial simulation tools”, Sensors and Actuators A, (1998), 15- 20
[4]P.M. Osterberg. S.D.Senturiz,M-test: a test chip for MEMS material property measurement using electrostatically actuated test structures. J.Microelectromech.Syst. 6 (2)(1997) 107-118.
[5]M-A.Gretillat,F. Gretillat, N.F.de.Rooij,Micromechanical relay with electrostatic actuation and metallic contacts. J.Microelectromech.Syst. 9 (1999) 324-331.
[6]P.osterberg. H. Yie, X. Cai, J.White, S.Senturia, Self-consistent simulation and modeling of electrostatically deforemd diaphragms, in :Proceedings of the Micro Electro Mechanical Systems Workshop, MEMS’94. Oiso,Japan,1994, pp.28-32.
[7]E.S.Humg, S.D.Senturia, Generating efficient dynamical models for microelectromechanical systems form a few finite-element simulation runs, J.Microelectromech.Syst. 8(3) (1999) 280-289.
[8]National Research Council, Microelectromechanical Systems: Advanced Materials
and Fabrication Methods, National Academy Press, Washington, DC, USA, 1997.
[9]M.A.Mignardi,Digital micromirror array for projection TV, Solid State Technol., (JULY) (1994) 63-68
[10]E.Graf,W.Kronsat, S. Duhring, B.Muller and A.Stoffel, Silicon membrane condenser microphone with integrated field-effect transistor, Sensors and Actuators A, 37-38 (1993) 708-711
[11]C-J. Kim, A,P. Pisano, R.S Muller and M.G. Lim, Polysilicon microgripper, Sensors and Actuators A, 33 (1992) 221-227
[12]K.A.Shaw, S.G.Adams and N.C.MacDonald, A single-mask lateral accelerometer, Porc.7th Int.Conf.Solid-State Sensors and Actuators (Transducers’93) Yokohama,Japan,9-12 June, 1993, pp.210-213
[13]H-C.Lee and R-S.Hung, A study on field-emission array pressure sensors, Sensors and Actuators A, 34(1992) 137-154
[14]P.B.Chu and K.S.J. Pister,Analysis of close-loop control of parallel-plate elecrostaticmicrogrippers, Proc. IEEE Int. Conf. Robotics Automation, SanDiego, CA, USA,May 1994, pp.820-825.
[15]D.Bosch,B.Heimhofer, G.Muck, H.Seidel, U.Thumser and W.Welser, A silicon, A silicon microvalve with combined electromagnetic/electrostatic actuation, Sensors and Actuators A, 37-38 (1993) 684-692
[16]H.P.Trah, H.Baumann, C.Doring, H.Goebel, T.Grauer and M.Mettner, Micromachined valve with hydraulically actuated membrane subsequent to a thermoelectricity controlled bimorph cantilever, Sensors and Actuators A,39(1993) 169-176
[17]H.Baltes, CMOS as sensor technology, Sensors and Actuators A,37-38 (1993) 51-56
[18]H.Crazzolara, G. Fach and W. von Munch, Piezoresistive accelerometer with overload protection and low cross-sensitivity, Sensors and Actuators A,39(1993) 201-207
[19]B.Chem. Structured design methods for MEMS. Final Report, NFS MEMS Workshop. Claifornia Institute of Technology,Pasandena. CA, USA, 1995
[20]S.D.Senturia. CAD for microelectromechanical systems, Invited Talk. Tech,Digest. 8th Inc. Conf. Solid-State Sensors and Actuators(Transducers ’95/EuroSenosorsIX),Stockholem, Sweden. 25-29 June, 1995 vol. 2 paper no.232-A7
[21]A.Berlin. Distributed MEMS: new Challengers for computation, IEEE Comput, Sei. Eng. 4 (1) (1997)
[22]B.Puers, CAD tools in mechanical sensor design, Sensors and Actuators 17 (1998) 423-429
[23]TSE GmbH, BOSS/Quattro User’s Guide. Version 1.5, Reutlingen,Germany, 1996
[24]S.M.Sze. Semiconductor Sensors. Willey, New York, 1994. ch.V
[25]H.Sandmater, A silicon based micromechanical accelerometer with cross acceleration sensitivity compensation. Tech. Digest. Transducers ’87 Berlin. Germany, 1987 pp.531-535
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